Material Science

Ultrafast laser/material interaction is being studied in detail to understand the fundamental mechanisms which drive ablation and collateral damage. Our work focuses on the damage and material removal processes in metals and semiconductors. We use a variety of characterization techniques including pump-probe ultrafast microscopy, femtosecond Laser Induced Breakdown Spectroscopy (fsLIBS), dual pulse LIBS, optical and scanning electron microscopy, transmission electron microscopy, and a variety of in-situ probes. Recently we discovered a novel approach to nano and micro fluidic channel manufacturing using ultrafast lasers. We are pursuing the development of this technique.